BYD Semiconductor Co., Ltd.

BYD Semiconductor's SiC power devices cover SiC MOSFET discrete devices and power modules, adopting double-side silver sintering technology and a pinfin baseplate for enhanced heat dissipation. The modules use self-developed high-performance SiC chips, featuring high integration, low switching losses, and high power-cycling and temperature-cycling capability. The official news page (IC China 2025 exhibition report) discloses: the 1500V high-voltage high-power SiC chip is the world's first 1500V high-voltage high-power SiC chip to enter mass vehicle production, with the full technology chain self-developed and self-manufactured, and it is the highest-voltage-class SiC chip ever put into large-scale mass production in automotive motor drive applications; the V-SSDC-A SiC module is an industry first that can meet 1000V voltage platform applications, adopting a 5nH low stray inductance design (reducing dynamic losses by 30% compared with conventional packaging), high-temperature-resistant molding material and nano-silver sintering technology, achieving a 200°C operating junction temperature, a power-cycling life more than 3 times that of conventional processes, random vibration tolerance exceeding 14G, and a 28% reduction in total volume versus conventional potted modules at the same output capability. In 2020, it launched China's first mass-produced SiC MOSFET installed in vehicles (applied to the BYD Han model). The official website states that its automotive IGBT/SiC module capacity and installed volume rank first globally.

SiC MOSFET discrete devices and power modules; 1500V high-voltage high-power SiC chip (world's first in mass vehicle production); V-SSDC-A double-side silver-sintered SiC module; 5nH low stray inductance design; 200°C operating junction temperature; random vibration exceeding 14G; total volume reduced by 28% at the same output capability

• New energy vehicle motor drive and control systems
• Vehicle thermal management systems
• On-board inverter systems
• Power conversion applications

BYD offers IGBT products in different forms including bare chips, discrete devices and power modules, covering 650V-1700V voltage platforms. It set up an IGBT R&D team in 2005, launched China's first self-developed IGBT chip in 2009, and introduced the IGBT 4.0 chip in 2018. The official news page (IC China 2025 exhibition report) discloses: IGBT 8.0 is a brand-new generation of self-developed chips manufactured with an ultra-deep-submicron process; its power density is claimed by the official website to be globally leading, defining new standards for e-drive IGBT chip efficiency and lightweight design; the DM4.0 IGBT module is fully self-developed by BYD and carries its own IGBT chips — a high-power silicon-based IGBT module custom-developed to match the DMi vehicle architecture, integrating power generation, inversion and boost functions, with low conduction and switching losses and strong overcurrent capability, using an elliptical heat-dissipating baseplate and AMB material for efficient cooling, and PPS (polyphenylene sulfide) material to meet high-temperature, high mechanical strength and high insulation strength requirements. IGBT modules adopt deep-submicron trench-gate field-stop IGBT chip technology and ultra-fast soft-recovery diode chips, with a variety of package structures and high heat dissipation efficiency.

IGBT 4.0 / 6.0 / 8.0 chips; 650V-1700V voltage platforms; DM4.0 IGBT module; deep-submicron trench-gate field-stop chip technology; ultra-fast soft-recovery diode; integrated generation/inversion/boost functions

• New energy vehicle motor drive and steering assist
• Industrial control
• Inverter home appliances
• Photovoltaics
• Energy storage
• Welding machines

The automotive-grade MCUs adopt highly reliable automotive-grade manufacturing processes, are strictly tested and certified to AEC-Q100 Grade 1 quality standards, follow production control procedures under the IATF 16949 system, and offer 8-bit and 32-bit core series with safety levels up to ISO 26262 ASIL-B. The first-generation 8-bit automotive MCU was launched in 2018 and the first-generation 32-bit automotive MCU in 2019, with more than 5 million units installed cumulatively; the official website calls it the brand with the most complete product series and the highest installed volume among domestic manufacturers, and it has launched a self-developed dedicated powertrain MCU with the highest clock frequency and computing power in China (a quad-core automotive-grade main-control MCU for power-domain e-drive control). The official news page (IC China 2025) discloses: the automotive-grade 18-channel BMS AFE is China's first mass-produced product installed in vehicles, supporting 18-channel voltage detection plus 9-channel temperature detection with battery voltage detection accuracy ≤1mV, integrating passive balancing switches and supporting a maximum balancing current of 300mA, and supporting looped daisy-chain communication with no cascading limit; the 32-bit automotive-grade general-purpose MCU doubles LATCH-UP and ESD performance, adds trace functionality and a hardware LIN module, and offers richer peripheral interfaces. The intelligent control IC line also includes battery protection ICs and power management chips (driver ICs, DC/DC, AC/DC, operational amplifier ICs).

8-bit/32-bit automotive MCUs; AEC-Q100 Grade 1 certified; ISO 26262 ASIL-B; 18-channel BMS AFE with voltage detection accuracy ≤1mV; maximum 300mA balancing current; over 5 million units installed cumulatively

• Vehicle lamps
• BLDC motor control
• Sensor detection
• Charging guns
• Control panels
• Body electronics such as PM2.5 detection
• Battery management systems (BMS)
• Body control / domain control / three-electric systems

BYD Semiconductor has a rich intelligent sensor product line covering current, temperature, pressure, position and angle sensors of all kinds. It focuses on the development of industrial-grade, automotive-grade and new-energy products, mainly manufacturing various electrical quantity detection sensors. Vehicle current sensor development began in 2008, and in 2013 the first automotive multi-in-one integrated current sensor was completed and put into mass application on models such as the E6, Qin, Tang, Song and Yuan; in September 2023, the development of a new high-current, high-precision, fast-response current sensor was completed, carried on BYD's high-end model Yangwang U8. The self-developed automotive-grade Hall current sensors feature high accuracy, fast response and electrical isolation, complying with AEC-Q100 and other standards. The angle position sensors focus on the R&D and manufacture of automotive-grade position, speed and angle sensors, achieving precise detection, multi-protocol signal transmission and functional integration; the temperature and pressure sensors focus on automotive-grade pressure and temperature sensors. The official news page states that its current sensors for new energy vehicles rank among the top domestic brands by installed volume.

Automotive-grade Hall current sensors; multi-in-one integrated current sensors; compliant with AEC-Q100; high-current, high-precision, fast-response current sensor (used on the Yangwang U8); coverage of current/temperature/pressure/angle product categories

• Automotive transmissions
• Engines
• Brake pedal assemblies
• Electric forklift steering systems
• Drive motor systems
• Battery management system (BMS) current monitoring
• Motor control
• Energy storage systems

BYD Semiconductor's intelligent power modules (IPM) integrate built-in driver and protection IC chips together with low-loss IGBT chips to achieve high-efficiency, highly reliable inverter functions, and can be used in compact, high-performance motor drive and control circuits. The official power semiconductor page lists multiple IPM products by the DIP25/DIP26/DIP27/DIP30 package series; the official news page (IC China 2025) shows IPMs being produced at scale together with IGBT and SiC modules.

DIP25-B-3215 / DIP26-S / DIP27-4426 / DIP30-7931 package series; built-in driver and protection IC chips; paired with low-loss IGBT chips; high-efficiency, highly reliable inversion

• Motor drive control for inverter home appliances (air conditioners/refrigerators, etc.)
• Industrial motor drives
• New energy vehicle related power conversion

The MOSFET product line listed on the official power semiconductor page is mainly applied in power supplies, DC-DC converter modules, motor control and automotive electronics, delivering best-in-class performance, improved efficiency and optimized thermal performance (SiC MOSFET discrete devices/modules are listed under the automotive-grade silicon carbide power devices entry).

Shielded-gate trench MOSFET; superjunction MOSFET; superjunction MOSFET modules; applications in power supplies/DC-DC conversion/motor control/automotive electronics; improved efficiency and optimized thermal performance

• Power supplies
• DC-DC converter modules
• Motor control
• Automotive electronics

BYD offers Diode products in different forms, including bare chips and TVS diodes. The supporting FRD wafer foundry platform features two process platforms with positive and negative temperature coefficients of forward conduction voltage, covering a voltage range of 200V~1200V.

FRD chips; TVS diodes; two process platforms with positive/negative temperature coefficient of forward conduction voltage; voltage range 200V~1200V; available as bare chips

• Automotive electronics
• Industrial control
• Industrial welding machines
• Inverter air conditioners

The BS32 series MCUs are general-purpose 32-bit high-performance, low-power microcontrollers based on Arm Cortex cores, offering Cortex-M0+ and Cortex-M4F core products with high integration, rich peripheral resources and easy development, plus supporting software and hardware development tools. BYD entered the industrial MCU field in 2007; the operating temperature is -40°C~125°C, the ESD capability is greater than ±8KV, cumulative shipments exceed 2 billion units, and the failure rate is below 10ppm.

BS32F0 (Cortex-M0+); BS32G0/BS32F1 (Cortex-M4F); operating temperature -40°C~125°C; ESD capability greater than ±8KV; cumulative shipments exceeding 2 billion units; failure rate below 10ppm

• Industrial control
• Human-machine interaction
• Motor drives
• Power supply monitoring
• Alarm systems
• Handheld devices
• Printers and scanners

Based on years of industry application experience, the home appliance MCUs adopt a high-speed MCU architecture with an ultra-high-sensitivity, strongly interference-resistant capacitive touch key detection module, integrate an innovative LED serial dot-matrix constant-current driver module and rich peripheral resources, and deliver high-performance, high-quality solutions.

8-bit/32-bit MCUs; ultra-high-sensitivity capacitive touch key detection module; strong interference immunity; integrated LED serial dot-matrix constant-current driver module; three-in-one integrated solution

• Home appliances
• Touch key control
• LED driver display
• Motor control

A single-chip controller aimed at smart door locks and vehicle smart-entry systems. It folds RFID card detection, capacitive touch keys and the whole lock-control logic into one MCU, taking the place of lock boards previously assembled from several separate chips. Because the surrounding circuitry shrinks, customers can serve several product tiers from a common hardware platform and shorten both validation cycles and production ramp-up.

Core: ARM Cortex-M0+, up to 48 MHz; on-chip memory: 64 KB Flash / 8 KB SRAM; supply range: 1.8-5.5 V, sleep current ≤1 µA; on-chip blocks: 13.56 MHz RFID detection front end plus 8 capacitive touch channels; peripheral interfaces: UART/I2C/SPI, 26 GPIOs; robustness: -40 °C to 85 °C, ESD ±8 kV, QFN32 package

• Smart door locks

BYD's AC-DC chips are highly integrated with built-in BJT/MOS, achieving constant current via PFM control and constant voltage via PFM+PWM, delivering high-precision constant-voltage constant-current output with comprehensive protection functions, meeting Energy Efficiency VI, and a built-in frequency dithering function to simplify EMI design. The official website lists a series of solutions: 5V3A series (BF1524, voltage accuracy ±5%, no-load power consumption <75mW), 20V3.25A series (BF1526, accuracy ±3%), 20V3.25A synchronous rectification series (BF1592, static current <460uA), automotive charging gun/charging pile auxiliary power solutions (BF1554C/BF1554D, accuracy ±5%, efficiency >80%), etc.

BF1524 (SOT23-6, external MOS, 15W, efficiency >87%); BF1526 (SSOP10, external MOS, 65W, efficiency >88%); BF1592 (synchronous rectification, reference accuracy ±1%); BF1554C/D (SOP8, built-in MOS, 12W/24W); meets Energy Efficiency VI; built-in frequency dithering to simplify EMI design

• Smartphone/tablet/laptop/router/speaker adapters
• Automotive charging guns
• Charging pile auxiliary power
• PV and energy storage auxiliary power
• Home appliances

BYD's battery protection ICs cover 1-15 cell lithium-ion/lithium-polymer/lithium-iron battery protection chips, featuring high accuracy, high integration and low power consumption with comprehensive protection functions; protection ICs and MOSFETs can be integrated, they can also work with precision resistors, and the cell capacity balancing function reduces capacity differences between cells and extends battery pack life. The official website provides a complete product series table by single/double/multi-cell (including detailed parameters such as overcharge/overdischarge/overcurrent/short-circuit detection voltages).

Coverage of 1-15 cell lithium-ion/lithium-polymer/lithium-iron battery protection; complete single-cell/dual-cell/multi-cell series; high accuracy, high integration, low power consumption; protection IC and MOSFET can be integrated; cell capacity balancing function

• Smartphone/tablet/laptop batteries
• Smart wearables (phones/bands/TWS earphones)
• Power tools/garden tools
• Robot vacuum/cordless vacuum/e-bike batteries

BYD driver ICs meet 600V/1200V driving requirements and are compatible with both IGBT and SiC devices. Official news (SEMI-e 2025 exhibition report) discloses that the isolated driver IC integrates multiple protection functions such as undervoltage protection and input interlock; the 1200V driver chip adopts magnetic isolation technology to achieve ultra-high-voltage driving, a first in China. Official news (IC China 2025) also showcases driver-type chip solutions such as the energy intelligent control chip built on the self-developed MCU+AFE and the vehicle voltage regulation chip that leverages higher switching frequencies for GaN onboard power supply solutions.

600V/1200V driving requirements; compatible with IGBT and SiC devices; multiple built-in protection functions including undervoltage protection and input interlock; 1200V magnetic isolation technology for ultra-high-voltage driving (a first in China)

• Photovoltaics and energy storage
• New energy vehicles
• Household appliances

BYD's multifunctional low-side N-channel MOSFET controller is suitable for boost, flyback, SEPIC and other circuit topologies, and can operate at extremely high switching frequencies to reduce the overall solution size. Official news (SEMI-e 2025) discloses that the boost flyback DC-DC IC features high input voltage withstand and an externally adjustable frequency, with built-in soft shutdown, circuit protection, overvoltage protection and other functions.

Low-side N-channel MOSFET controller; suits boost/flyback/SEPIC topologies; operation at extremely high switching frequencies; high input voltage withstand; externally adjustable frequency; built-in soft shutdown, circuit protection and overvoltage protection

• Boost/flyback/SEPIC power topologies
• Automotive and portable electronic devices

BYD's operational amplifier series features rail-to-rail input and output, low offset voltage and a stable high-frequency response, suitable for automotive and portable electronic devices with limited space.

Rail-to-rail input/output; low offset voltage; stable high-frequency response

• Automotive electronics
• Portable electronic devices

BYD Semiconductor's self-capacitance touch screen control chips integrate an MCU and self-capacitance detection circuitry internally, providing customers with high-performance, high-quality products and overall solutions. The official website lists models such as BF6881A, BF5211A and BF5212A.

Self-capacitance touch screen control; built-in MCU and self-capacitance detection circuit; models BF6881A/BF5211A/BF5212A

• Touch screen control
• Home appliance panels

Battery management ICs provide chip solutions for battery management systems. The product portfolio includes multi-channel analog front-end ICs, smart battery management ICs and communication ICs, providing dedicated ICs for industrial and automotive battery management applications. Official news (SEMI-e 2025) discloses: the AFE precisely adapts to extreme in-vehicle operating conditions; the daisy-chain isolated communication chip provides highly reliable safeguards for data transmission between the battery pack and the vehicle control system; China's first PACK high-voltage monitoring chip performs integrated centralized measurement of PACK total voltage, total current and insulation resistance; the 12V starting battery dedicated AFE is China's first automotive-grade multi-in-one ASIC, capable of acquiring cell voltage, module voltage, current and temperature, integrating current accumulation and overcurrent/over-temperature hardware protection, and combining high-side drive with a CAN communication transceiver module. Official news (IICIE 2026) states that its automotive-grade BMS AFE has the most complete product range among domestic manufacturers and ranks first in vehicle installations, offering the world's highest-integration complete automotive BMS ASIC solution.

Multi-channel analog front-end ICs, smart battery management ICs and communication ICs; daisy-chain isolated communication chip; integrated centralized measurement of PACK total voltage/total current/insulation resistance; 12V starting battery dedicated AFE, China's first automotive-grade multi-in-one ASIC; acquires cell voltage, module voltage, current and temperature; integrated current accumulation and overcurrent/over-temperature hardware protection; high-side drive combined with CAN communication transceiver

• New energy vehicle power battery BMS
• 12V low-voltage battery management
• Energy storage system BMS
• Industrial battery management

BYD CMOS image sensors are divided into two major categories: consumer and security surveillance & automotive. The consumer product series covers 5MP, 2MP, 0.3MP and 0.08MP products; the official website states that its market share in the low-to-mid pixel product market exceeds 50%, with volume adoption by brand customers including ASUS, Huawei, Sony, Nokia and LG. The security surveillance and automotive category covers PAL/NTSC analog output, large-target 0.3MP, 720P, 960P, full HD 1080P, linear array and other product series.

Consumer series covering 0.08MP-5MP; market share in the low-to-mid pixel product segment exceeding 50%; security and automotive series covering PAL/NTSC analog output, large-target 0.3MP, 720P, 960P, 1080P full HD and linear array series

• Mobile phones/tablets/wearables/toys
• Security surveillance cameras
• Network cameras
• Vehicle cameras
• Industrial control cameras
• Drone cameras
• Barcode scanning equipment
• Front-view perception/peripheral and surround imaging/360° panoramic imaging

BYD Semiconductor owns an embedded fingerprint recognition sensor product line. The official smart sensor page lists fingerprint products (fingerprint chips, fingerprint MCUs, fingerprint modules) and lock-control MCUs under the biometrics category, with full-stack in-house development capability.

Embedded fingerprint recognition sensor product line; fingerprint chips/fingerprint MCUs/fingerprint modules/lock-control MCUs; full-stack in-house development capability

• Smart door locks
• Consumer electronics identity recognition

BYD Semiconductor is one of the few semiconductor manufacturers in China capable of mass-producing automotive-grade LED light sources for factory installation. The LED lamps of its light source products pass the AEC-Q101 standard, cover all application requirements of automotive lamps, and have accumulated more than 2 million vehicle installations in the factory-installation market. The official optoelectronic semiconductor page (IC China 2025 news) announces the launch of China's first high-luminous-efficiency headlamp light source in scale installation, ADS driver-assistance dedicated light sources, and the self-developed 100-pixel-class ADB light source (108 pixels, the industry's highest). The LED product series covers LED smart lighting, LED smart display and automotive LED applications (the LED industry's first motorcycle headlamp, first factory-installed in-vehicle display, first outdoor P2.0 in-vehicle display and first touch-controlled air-conditioning panel).

LED lamps compliant with the AEC-Q101 standard; over 2 million cumulative vehicle installations in the factory-installation market; 100-pixel-class ADB headlamp light source (108 pixels, the industry's highest); LED industry's first motorcycle headlamp, first factory-installed in-vehicle display, first outdoor P2.0 in-vehicle display and first touch-controlled air-conditioning panel

• Automotive headlamps/ADB adaptive high beam
• In-vehicle displays
• LED indoor and outdoor displays
• Smart lighting for retail/hotels/factories

BYD has been developing optoelectronic semiconductor products since 2003. Smart in-vehicle products cover streaming-media interior rearview mirrors, vehicle night vision systems, DMS anti-fatigue systems (host input voltage 9-16V, supporting 2 video inputs, 720p IR sensing, 60fps), AR-HUD PGU optical engines, vehicle PM2.5 detectors, road preview systems, MEMS sensors (silicon microphones, air-flow sensors), automotive fragrance control modules (JG-HC-XF, JG-JKX1-XF), etc. The camera module series covers HD panoramic imaging, ADAS side-view/rear-view/8MP front-view binocular, streaming-media rearview, scanning modules (CSM3112 barcode imaging engine), in-cabin video, dash cameras, vehicle imaging integrated systems, DMS infrared camera modules (FACE ID/DMS/gesture recognition/emotion recognition), and MPC camera modules (supporting ACC-S&G, lane keeping, AEB, TSR, etc.). Official news states that multiple products have been installed in volume on BYD's God's Eye vehicle platforms.

HD panoramic camera modules 1MP/2MP/3MP functional safety; ADAS modules 8MP front-view binocular; streaming-media interior mirror with 80° field of view, <50ms latency, 60fps, 1500lm bright automotive-grade screen; vehicle night vision with 150-200m range and >95% pedestrian recognition accuracy; DMS IR camera module 2MP functional safety ASIL-B; 360 surround-view panoramic module with 200° horizontal angle; dash camera module 1920*1080, FNO1.8, 126°; DMS host input voltage 9-16V, 2 video inputs, 720p IR sensing, 60fps

• Smart cockpit systems
• ADAS driver assistance
• 360 panoramic/reversing imaging
• Driver monitoring (DMS)/passenger monitoring (OMS)
• Dash recording/night-vision assisted driving
• Cabin interior/exterior air quality monitoring

The smart security category of the official optoelectronic semiconductor page: consumer-grade self-developed smart cameras, including card-type, bullet and PTZ cameras, customizable to customer requirements; industrial products feature strong standardization and parameter specifications, and the company holds qualifications for security technical protection system design, construction and maintenance; a general-purpose 16-bay network video recorder is also provided.

Consumer smart cameras (card-type/bullet/PTZ); industrial security dome/bullet 2MP cameras; general-purpose 16-bay network video recorder; qualified for security system design, construction and maintenance

• Home security monitoring
• Industrial security projects
• Network video storage

The optical components and structural parts category of the official optoelectronic semiconductor page includes lenses, light-shaping devices, thick-wall molded lenses (automotive-grade/non-automotive), as well as structural parts and heat sinks: automotive-grade/industrial-grade IGBT housings, copper/carbon baseplates for IGBT and silicon carbide modules, sensor housings, etc., providing supporting structural parts for power module and sensor products.

Thick-wall molded lenses (automotive/non-automotive); automotive-grade/industrial-grade IGBT housings; copper/carbon baseplates for IGBT and SiC modules; sensor housings; lenses and light-shaping devices

• Automotive-grade/industrial IGBT and SiC module packaging support
• Sensor packaging support
• Automotive optics

BYD Semiconductor's foundry business comprises two parts: wafer manufacturing and packaging & testing. Products cover automotive IGBT and FRD wafer manufacturing, as well as DFN/QFN packaging & testing, wafer dicing, wafer testing and finished product testing services. Wafer dicing capability covers silicon, Taiko and SiC wafer cutting processes; testing capability provides customized product test development services such as CP, FT and Tri-Temp. Optional CMOS wafer processes include HiR (1-3Kohm/SQ), PIP (0.54-1.4fF/um2), Zener (5-6V), power top metal (1.5um), metal fuse, etc., customizable to customer requirements.

IGBT wafer 600V/1200V foundry platform; FRD wafer 200V-1200V with positive/negative temperature coefficient process platforms; CMOS wafer operating voltage 5V-40V; TMBS wafer 20V-150V trench MOS Schottky process; Si/Taiko/SiC wafer dicing; CP/FT/Tri-Temp customized test development; optional CMOS processes HiR (1-3Kohm/SQ), PIP (0.54-1.4fF/um2), Zener (5-6V), power top metal (1.5um)

• New energy vehicle motor drive and steering assist
• Inverter air conditioners
• Welding machines
• Automotive/industrial/consumer chip foundry