Shengyi Technology

Shengyi's automotive product family, described on the official website as a series of copper-clad laminates for automotive electronics. Members: Autolad1 - high-performance, lead-free-compatible medium-Tg board for automotive use; Autolad1G - halogen-free medium-loss, high-Tg HDI material for automotive use; Autolad2G and Autolad2GH - high-CTI, high-performance, halogen-free, lead-free-compatible high-Tg boards for automotive use; Autolad3 - high-performance, lead-free-compatible high-Tg board for automotive use; Autolad3G - ultra-low-CTE, high-performance, halogen-free, lead-free-compatible high-Tg material for automotive use; Autolad4G - Low Dk, halogen-free, high-Tg board for automotive use; Autolad6G - Low Dk, Low Loss, halogen-free, high-Tg board for automotive use; S1151G - halogen-free, high-CTI board for automotive use.

Model: Autolad1, Autolad1G, Autolad2G, Autolad2GH, Autolad3, Autolad3G, Autolad4G, Autolad6G, S1151G; Dielectric constant Dk: 3.0 to 3.8 at 10 GHz; Dissipation factor Df: 0.005 to 0.010 at 10 GHz; Glass transition temperature Tg: 155 to 220 C; Z-axis CTE: 1.2 to 2.8 ppm per C; Comparative tracking index CTI: PLC 0 to PLC 3; Laminate thickness: 0.05 to 1.6 mm; Peel strength: at least 1.0 N per mm

• Automotive electronics
• Lead-free-compatible automotive multilayer boards
• Automotive HDI circuit boards
• High-CTI automotive electronic control and power circuits

A series of copper-clad laminates for millimeter-wave radar within the RF & microwave product family. Official descriptions: mmWave G - low-loss high-frequency PPO copper-clad laminate for millimeter-wave radar; mmWave77 - low-loss PTFE copper-clad laminate for millimeter-wave radar.

Original parameters from the official product list (Dk / Df): mmWave G: Dk 3.15, Df 0.002; mmWave77: Dk 3.0, Df 0.0010.

• Millimeter-wave radar
• Automotive millimeter-wave radar
• 77 GHz RF front-end circuits

A series of high-frequency hydrocarbon copper-clad laminates within the RF & microwave product family. The official brief description is 'high-frequency hydrocarbon copper-clad laminate'; grades are offered by dielectric constant, including LNB33C and LNB33C(340), LNB33C(345), LNB33C(350).

Original parameters from the official product list (Dk / Df): LNB33C: Dk 3.30, Df 0.0030; LNB33C(340): Dk 3.40, Df 0.0033; LNB33C(345): Dk 3.45, Df 0.0035; LNB33C(350): Dk 3.50, Df 0.0035.

• Automotive high-frequency circuits
• Automotive radar RF circuits
• High-frequency antennas and microwave circuits

A series of high-thermal-conductivity RF materials within the RF & microwave product family. The official brief description is 'high-thermal-conductivity RF material'; the series comprises two grades, SG7350D and SG7350D2.

Original parameters from the official product list (Dk / Df): SG7350D: Dk 3.55, Df 0.0022; SG7350D2: Dk 3.55, Df 0.0020.

• Automotive RF power circuits
• Automotive radar RF modules
• High-conductivity RF and microwave circuits

A series of glass-fabric-reinforced PTFE copper-clad laminates for antenna RF circuits within the RF & microwave product family. The official brief description is 'glass-fabric-reinforced PTFE copper-clad laminate for antenna RF circuits'; the series includes SCGA-500 GF220 and SCGA-500 GF255.

Original parameters from the official product list (Dk / Df): SCGA-500 GF220: Dk 2.20, Df 0.0009; SCGA-500 GF255: Dk 2.55, Df 0.0014.

• Antenna RF circuits
• Automotive antenna and radar antenna circuits
• Microwave RF circuits

High-speed product family, described on the official website as a series of laminate materials for high-speed (multilayer) circuits: Synamic8GX - ultra-low-loss, high-heat-resistant-layer, halogen-free multilayer laminate material for high-speed circuits; Synamic9GN - ultra-low-loss, high-heat-resistant-layer, halogen-free multilayer laminate material for high-speed circuits; S7439GS - low dielectric loss, halogen-free, high-heat-resistant laminate material for high-speed circuits (FR15.1); S7045GX - low expansion coefficient, medium-low dielectric loss, high-heat-resistant halogen-free laminate material for high-speed circuits; S7045G - medium dielectric loss, high-heat-resistant halogen-free laminate material for high-speed circuits; S7045GH - medium dielectric loss, high-heat-resistant halogen-free laminate material for high-speed circuits; S7040G - medium dielectric loss, high-heat-resistant halogen-free laminate material for high-speed circuits; S7439 - low dielectric loss, high-heat-resistant laminate material for high-speed circuits; S7439C - low dielectric loss, high-heat-resistant laminate material for high-speed circuits; S7045GHU - halogen-free high-reliability medium-loss material.

Original parameters from the official product list (Dk / Df): Synamic8GX: Dk 3.62, Df 0.0016; S7045GHU: -- / --; S7439GS: Dk 3.98, Df 0.0040; S7045GX: -- / --; Synamic9GN: Dk 3.34, Df 0.0014; S7045G: Dk 4.30, Df 0.010; S7045GH: Dk 3.95, Df 0.0095; S7040G: Dk 3.72, Df 0.0089; S7439: Dk 3.66, Df 0.0060; S7439C: Dk 3.66, Df 0.0060.

• High-speed circuits
• Automotive high-speed signal transmission circuits
• High-speed multilayer boards for autonomous-driving domain controllers

Metal-base and high-thermal-conductivity product family. Official brief descriptions: ST110G - halogen-free, high-thermal-conductivity substrate; SAR10S - halogen-free, high-CTI aluminum-base copper-clad laminate; SAR15 - halogen-free, high-CTI aluminum-base copper-clad laminate; SAR20H - halogen-free, high-CTI adhesive-film-type aluminum-base copper-clad laminate; SCR20S - halogen-free, high-CTI adhesive-film-type copper-base copper-clad laminate; SAR30 - halogen-free, high-CTI adhesive-film-type aluminum-base copper-clad laminate. These high-conductivity metal-base materials suit heat-dissipation scenarios such as automotive power electronics and LED lighting.

Original parameters from the official product list (thermal conductivity W/m·K): ST110G: 1.0; SAR10S: 1.1; SAR15: 1.5; SAR20H: 2.1; SCR20S: 2.1; SAR30: 3.0.

• Automotive power electronics heat dissipation
• Automotive LED lighting substrates
• High-conductivity metal-base circuit boards

The 'Standard FR-4.0' sub-series under Shengyi's standard rigid product category, halogen-containing general-purpose FR-4 copper-clad laminates and prepregs. Official brief descriptions: S1130 - natural-color board, Tg130°C (DSC), natural color, without UV Blocking/AOI compatibility, excellent machinability; S1141 - UV board, Tg140°C (DSC), UV Blocking/AOI compatible, excellent machinability; S1141 150 - UV board, medium Tg, Tg150°C (DSC), excellent PCB processability; Q100C - UV board with UV blocking/AOI compatibility; S1600 - excellent tracking resistance CTI≥600V, UV Blocking, excellent PCB processability (not suitable for solder-mask rewashing).

Original parameters from the official product list (CTE / Tg / Td): S1130: CTE 4.50%, Tg 135, Td 310; S1141: CTE 4.50%, Tg 140, Td 310; S1141 150: no values given in the official list (detail-page features list Tg150°C (DSC)); Q100C: CTE 3.5%, Tg 140, Td 330; S1600: CTE 4.50%, Tg 135, Td 310, CTI≥600V. Additional features: S1130 is not suitable for CAF-required applications, nor for thick copper above 2oz / HDI or multilayer boards above 12 layers; S1141 150 and S1600 are UV Blocking/AOI compatible.

• Computers
• Camcorders
• Communication equipment
• TV sets
• Electronic game consoles
• Instruments and meters
• VCRs
• Consumer electronics

The 'Lead-free-compatible FR-4.0, FR-15.0' sub-series under Shengyi's standard rigid product category. Official brief descriptions: S1000 - low-CTE medium-Tg board; S1000H - low-CTE medium-Tg board; S1000-2 - low-CTE, high-heat-resistant, high-Tg board, Tg170°C (DSC), UV Blocking/AOI compatible; S1000-2M - low-CTE, high-heat-resistant, high-Tg board for high-multilayer PCBs; S1600L - brief introduction CTI600, with low Z-axis thermal expansion and excellent CAF resistance; S1190 - high-Tg, high-reliability, high-heat-resistant substrate for high multilayers. The whole series is lead-free-compatible and CAF-resistant.

Original parameters from the official product list (CTE / Tg / Td): S1000: CTE 3.40%, Tg 155, Td 335; S1000H: CTE 2.80%, Tg 155, Td 348; S1000-2: CTE 2.80%, Tg 180, Td 345; S1000-2M: CTE 2.40%, Tg 180, Td 355; S1600L: CTE 3.20%, Tg 150, Td 355; S1190: CTE 2.3%, Tg 200, Td 350. Common features: CAF resistance, lead-free compatibility, excellent heat resistance and via reliability, low water absorption; S1600L and the S1600 series have CTI≥600V.

• Computers and laptops
• High-multilayer PCBs
• Lead-free-process multilayer boards

The 'Halogen-free lead-free-compatible FR-4.1, FR-15.1' sub-series under Shengyi's standard rigid product category. Official brief descriptions: S1150G - halogen-free medium-Tg board (UL ANSI: FR4.1), free of halogens, antimony and red phosphorus, with good machinability and heat resistance, lead-free-process compatible and CAF-resistant; S1170G - halogen-free high-Tg board (FR-15.1), CAF-resistant, lead-free compatible, with excellent via reliability; S1190G - halogen-free high-Tg, Low CTE, FR-15.1, with excellent CAF resistance and high-voltage resistance, high Tg 200°C (DMA) and low Z-axis expansion; S1150GH - (UL ANSI: FR4.1) halogen-free medium-loss multilayer substrate for PCBs, with lower loss than conventional medium-Tg FR-4.1; SML02G - medium dielectric loss, high-heat-resistant halogen-free laminate material for high-speed circuits, high Tg >170°C (DSC).

Original parameters from the official product list: S1150G: CTE 2.8%, Tg 155, Td 355; S1170G: CTE 2.3%, Tg 180, Td 390; S1190G: CTI PLC3, Dk 4.3, Df 0.011, CTE 1.8%, Tg 190, Td 408; S1150GH: Df/10GHz 0.008, Tg 160, Td 390; SML02G: Dk 4.29, Df 0.010, CTE 1.1%, Tg 175, Td 410. Additional SML02G features: low X/Y-axis CTE (<13ppm), Dk/Df@10GHz 4.24/0.0069, excellent ion-migration resistance.

• Smartphones
• Tablets
• Laptops
• High-multilayer PCBs
• Halogen-free laminates for high-speed circuits

The 'CEM-3, CEM-3.1' sub-series of composite-base copper-clad laminates under Shengyi's standard rigid product category. Official brief descriptions: S2130 - general-purpose board, punchable, longer drill-bit life in drilling, excellent electrical performance, PTH reliability comparable to FR-4.0, without UV blocking; S2131 - general-purpose UV board, good machinability, UV Blocking/AOI compatible, excellent electrical performance; S2126 - high-CTI board with excellent tracking resistance CTI≥600V; S2155G - halogen-free eco board, free of halogens, antimony and red phosphorus; S2600F - high heat resistance, low water absorption, high CTI, CAF-resistant board; Q260 - thermally conductive CEM-3, good thermal conductivity and tracking resistance (CTI>600V); ST210G - thermally conductive CEM-3 with high CTI, thermal conductivity≥1.0 W/m·K, lead-free compatible, white opaque substrate with good light shielding and reflection.

Original parameters from the official product list (CTE / Tg / Td): S2130: CTE 5.2%, Tg 130; S2131: CTE 5.2%, Tg 130; S2126: CTE 5.2%, Tg 130; S2155G: CTE 4.8%, Tg 130, Td 335; S2600F: CTE 4.3%, Tg 130, Td 332; Q260: CTE 3.5%, Tg 122; ST210G: CTE 3.5%, Tg 122, Td 360, thermal conductivity≥1.0 W/m·K.

• Instruments and meters
• Information appliances
• Automotive electronics
• ATMs
• Game consoles
• Automatic controllers
• LED/backlight light-shielding and reflective substrates

The 'CEM-1' sub-series of composite-base copper-clad laminates under Shengyi's standard rigid product category. Official brief descriptions: S3110 - general-purpose board with good heat resistance, moisture resistance, flatness, and good mechanical and electrical performance; S3116 - high-heat-resistant, high-CTI board with excellent tracking resistance CTI>600V; Q360G - high-CTI halogen-free eco board with good machinability, free of halogens/antimony/red phosphorus, high CTI.

Original parameters from the official product list (CTE): S3110: CTE 6.2%; S3116: CTE 6.5%, CTI>600V; Q360G: no values given in the official list; detail-page features list high CTI and halogen-free.

• Power supplies
• Game machines
• Household appliances
• Single-/double-sided general-purpose circuit boards

The HDI material family under Shengyi's smart terminal product category, for high-density interconnect circuit boards of smartphones and other smart terminals. Official brief descriptions: SDI03K - Low Dk, halogen-free high-Tg FR-4.1 material, lead-free compatible, high-Tg halogen-free (Tg190°C (DMA)), UV blocking/AOI compatible, good dimensional stability; SDI06K - Low Dk, Low Loss, halogen-free high-Tg FR-15.1 material, lead-free compatible, high-Tg halogen-free (Tg220°C (TMA)), low X/Y/Z-axis CTE, low dielectric constant and loss.

Original parameters from the official product list: SDI03K: CTE 2.1%, Tg 165(TMA), Td 390; SDI06K: CTI PLC3, Df/10GHz 0.0075, Dk/10GHz 3.5, CTE 1.2%, Tg 220, Td 420.

• Smartphones
• Smart terminal HDI circuit boards
• High-density interconnect multilayer boards

The package substrate material family under Shengyi's IC packaging products (substrates and films) category. Official brief descriptions: SI13U - Low-CTE substrate material for package substrates, Tg≥230°C (DMA), Td>400°C (5% loss, TGA), high flexural modulus, low X/Y/Z-axis CTE, good punching and drilling processability, halogen-free and lead-free-process compatible, RoHS/WEEE compliant; SI10US - high-performance substrate material for package substrates, low CTE and high modulus to effectively reduce package substrate warpage, excellent damp-heat resistance, good PCB processability, halogen-free; WLM1 - high-Tg white material for Mini-LED backlight units, lead-free compatible, with excellent consistency under thermal aging and blue-light aging.

Original parameters from the official product list (CTE / Tg / Td): SI13U: CTE 13, Tg 245, Td >400; SI10US: CTE 10, Tg 280, Td >400; WLM1: CTE 1.9, Tg 180, Td 374. The official detail page also states for SI13U: Tg≥230°C (DMA), Td>400°C (5% loss, TGA).

• IC package substrates
• IC substrates
• Mini-LED backlight modules

The 'Resin-coated copper foil' sub-series under Shengyi's specialty product category. Official brief description: S6015 is a halogen-free RCC (resin-coated copper foil), free of halogens and glass-fiber reinforcement, suitable for conventional HDI fabrication; no resin powder shedding and low contamination; shelf life comparable to conventional FR-4.0 prepregs; low dielectric constant, beneficial for impedance control and higher signal transmission speed.

Original parameters from the official product list: Tg 145, Td 330 (no CTI/CTE/Dk/Df values listed in the official list).

• HDI circuit boards
• Build-up multilayer boards
• Glass-fiber-free insulation layers

The 'Specialty bonding materials' sub-series under Shengyi's specialty product category (prepregs / bonding sheets). Official brief descriptions: SP168GN - non-flow, dust-free PP with excellent machinability, suited to lamination processes, minimal resin flow, very few chips during flexing, high-Tg halogen-free; SP175M - high-performance lead-free bonding sheet, lead-free compatible, excellent thermal reliability, low Z-axis thermal expansion, low water absorption, for high aspect-ratio and high-multilayer PCBs; SP225GN - high-Tg, high-stiffness no-flow PP, excellent machinability (punchable), improving the warpage resistance of rigid-flex boards.

Original parameters from the official product list: SP168GN: Dk/10GHz 3.75, Df/10GHz 0.015, application fields CCM modules / Multilayer modules / Rigid-Flex modules; SP225GN: Tg 225, Td 410; SP175M: CTE 3.8%, Tg 170, Td 348.

• CCM modules
• Multilayer modules
• Rigid-Flex modules
• High aspect-ratio and high-multilayer PCBs
• Rigid-flex boards

The 'Rigid polyimide materials' sub-series under Shengyi's specialty product category. Official brief description: SH260 is a halogen-free high-performance polyimide board based on a Polyimide resin system with ultra-high heat resistance; toughened resin system, non-MDA chemistry; retains mechanical strength and bonding strength at high temperatures; halogen-free, lead-free-process compatible; RoHS/WEEE compliant.

Original parameters from the official product list: CTE 1.2%, Tg >250 (TMA), Td 429.

• High heat-resistant printed circuit boards
• High-temperature reliability electronic modules
• Halogen-free high-temperature substrates

The 'Eco materials' sub-series under Shengyi's specialty product category. Official brief description: Recyclad1G is a degradable, recyclable, halogen-free medium-Tg material - degradable and recyclable, lead-free compatible, free of halogens, antimony and red phosphorus.

Original parameters from the official product list: Dk 4.5, Df 0.010, Tg 153, Td 370.

• Recyclable/degradable printed circuit boards
• Green eco electronic substrates

The 'Flexible copper-clad laminates' sub-series under Shengyi's flexible materials product category. Official brief descriptions: SF305 - general halogen-free adhesive-based substrate, free of halogens, flame retardancy UL94 V-0, excellent flexibility, heat resistance, dimensional stability and electrical performance, RoHS compliant; SF202 - adhesiveless double-sided substrate, excellent heat resistance, dimensional stability and chemical resistance, flame retardancy UL94 VTM-0; SF230 - laminating-type Low Df adhesiveless double-sided board, low dielectric loss, insertion loss close to LCP; SF325 - ion-migration-resistant adhesive-based substrate, excellent ion-migration resistance without dendritic growth; SF490 - large-size transparent board, high bond strength, good dimensional stability, excellent light transmittance; SL - adhesiveless single-sided substrate; SLF - Low Df adhesiveless single-sided FCCL, low Dk/Df; DL - adhesiveless double-sided substrate; DLF - low signal loss modified-PI flexible copper-clad laminate; SF224 - fluororesin-composite FCCL, low dielectric constant, low transmission loss.

Original parameters from the official product list (Dk/10GHz, Df/10GHz): DLF: 3.4 / 0.0033, application field 5G Antenna modules; SF224: 2.49 / 0.0023, application field 5G Antenna modules; SF325: Dk 3.25@1GHz, Df 0.012@1GHz, application fields EV power battery protection boards / Antenna modules / Cable / automotive modules; SLF: 3.2 / 0.0032. Other grades have no Dk/Df values in the official list; features include halogen-free, UL94 V-0 or VTM-0 flame retardancy, RoHS compliance.

• 5G antenna modules
• EV power battery protection boards
• Automotive modules
• Cables
• Medical instruments
• Flexible printed circuit boards

The 'Coverlay films' sub-series under Shengyi's flexible materials product category. Official brief descriptions: SF206C - Low Dk/Df coverlay film, low dielectric constant, low transmission loss, good processability, suited to rapid and conventional lamination; SF305C - general halogen-free coverlay film, halogen-free, flame retardancy UL94 V-0, high bond strength, low resin bleed; SF315C - black halogen-free coverlay film, low transparency, excellent light shielding; SF325C - ion-migration-resistant coverlay film, excellent ion-migration resistance without dendritic growth; SF335C - halogen-free, phosphorus-free coverlay film; SF240C - ultra-high-temperature polyimide coverlay film, short-term heat resistance up to 350°C, Tg>230°C, high elastic modulus, excellent ion-migration resistance; SF385 - halogen-free PI-based transparent substrate, high bond strength, excellent heat resistance and light transmittance; SF385C - halogen-free PI-based transparent coverlay film; SF202C - high-heat-resistant polyimide coverlay film, excellent ion-migration resistance and thermal-aging resistance, lower dielectric constant and dissipation factor at high frequencies.

Original parameters from the official product list (Dk/10GHz, Df/10GHz): SF385C: 3.3 / 0.0187; SF385: 3.2 / 0.019; SF240C: 3.4 / 0.014, application fields EV power battery protection boards / automotive modules; SF202C: 3.43 / 0.0135, application fields Cable / Medical Instrument. Flame-retardancy grades as stated on the official website: SF206C/SF305C/SF315C/SF335C/SF240C/SF202C/SF385C are UL94 V-0, and SF325C is UL94 VTM-0.

• EV power battery protection boards
• Automotive modules
• Cables
• Medical instruments
• Transparent PI coverlay applications
• Flexible circuit protection

The 'Adhesive films' sub-series under Shengyi's flexible materials product category. Official brief descriptions: SF206B - Low Dk/Df adhesive film, low dielectric constant, low transmission loss, good adhesion to copper foil and PI, halogen-free, flame retardancy UL94 V-0, good processability, suited to conventional lamination; SF315B - general halogen-free adhesive film, high bond strength, good dimensional stability, excellent heat resistance, chemical resistance and electrical performance, low resin bleed, good processability, suited to rapid and conventional lamination. Both meet RoHS directive requirements.

The official product list gives no Dk/Df values for these two grades; the official features list states flame-retardancy grade UL94 V-0, halogen-free, low resin bleed, suited to conventional and rapid lamination processes.

• FCCL bonding layers
• PI-to-copper-foil bonding
• Flexible circuit lamination

The 'Insulating films for laminated busbars' sub-series under Shengyi's flexible materials product category. Official brief descriptions: BIF201 and BIF202 are polyester adhesives for laminated busbars, and BIF203 is a halogen-free black insulating coverlay film; all three offer excellent adhesion, heat resistance, dimensional stability, bending resistance and insulation; halogen-free flame retardancy reaching UL94 VTM-0; low resin bleed and good processability, suited to rapid and conventional lamination, reworkable and storable at room temperature; meet RoHS directive requirements.

Original parameters from the official product list: BIF203: Dk/10GHz 3.20, Df/10GHz 0.02; no Dk/Df values are given for BIF201 and BIF202 in the official list. The official features list states: halogen-free flame retardancy up to UL94 VTM-0, low resin bleed, reworkable, storable at room temperature, RoHS compliance.

• Laminated busbar insulation
• CCS hot pressing
• NEV busbar insulation
• Power-electronics busbars

The 'Stiffener boards' sub-series under Shengyi's flexible materials product category. Official brief description: SF305R is a halogen-free flame-retardant polyimide film stiffener, halogen-free and phosphorus-free, flame retardancy UL94 V-0; high bond strength and good dimensional stability; excellent heat resistance, chemical resistance and electrical performance; low resin bleed, good processability, suited to rapid and conventional lamination; meets RoHS directive requirements.

Dielectric const.:3.27; Loss factor:0.0139; Board thickness:0.05 mm~0.20 mm; Flame class:UL94 V-0; Material:Halogen-free; Frequency band:10 GHz

• Flexible circuit board stiffening
• Local FPC stiffening
• Rigid-flex boards

Grades not previously included in the 'Hydrocarbon series products' sub-series of Shengyi's RF & microwave materials category. The official brief descriptions are all 'high-frequency hydrocarbon copper-clad laminate', i.e. high-frequency copper-clad laminates based on hydrocarbon resin systems, for high-frequency microwave circuits.

Original parameters from the official product list (Dk / Df): LNB33: Dk 3.30, Df 0.0025; S7136H: Dk 3.42, Df 0.0030.

• High-frequency circuits
• Microwave RF circuits
• Base-station RF front ends
• Automotive high-frequency circuits

Grades not previously included in the 'PTFE Type' sub-series SCGA-500 of Shengyi's RF & microwave materials category. The official brief description is 'glass-fabric-reinforced PTFE copper-clad laminate for antenna RF circuits', i.e. PTFE (polytetrafluoroethylene) copper-clad laminates reinforced with electronic-grade glass fabric, supplied in grades by dielectric constant.

Original parameters from the official product list (Dk / Df): SCGA-500 GF265: Dk 2.65, Df 0.0017; SCGA-500 GF300: Dk 3.00, Df 0.0023.

• Antenna RF circuits
• Microwave RF circuits
• Phased arrays and RF front ends
• Automotive radar antenna circuits

A grade not previously included in the 'Thermoset resin systems' sub-series of Shengyi's RF & microwave materials category. Official brief description: AeroWave 300 is an electronic-grade glass-fabric-reinforced thermoset copper-clad laminate for high-frequency circuits.

Dielectric const.:3.0; Loss factor:0.0031; Board thickness:0.25 mm~3.2 mm; Copper foil thick.:18 µm~70 µm; Tg:180℃~220℃; Peel strength:≥1.0 N/mm; Water absorption:≤0.2%

• High-frequency circuits
• Microwave antenna circuits
• RF front-end circuits

Grades not previously included in the 'Ultra-low dielectric loss' sub-series of Shengyi's high-speed product category. Official brief descriptions: Synamic 6 - low dielectric constant, ultra-low dielectric loss, high-heat-resistant laminate material for high-speed circuits; Synamic 6N - low dielectric constant, ultra-low dielectric loss, high-heat-resistant laminate material for high-speed circuits; Synamic 6GX - low dielectric constant, ultra-low dielectric loss, halogen-free, high-heat-resistant laminate material for high-speed circuits; Synamic8G and Synamic8GN - ultra-low-loss, high-heat-resistant-layer, halogen-free multilayer laminate materials for high-speed circuits.

Original parameters from the official product list (Dk / Df): Synamic 6: Dk 3.68, Df 0.0036; Synamic 6N: Dk 3.35, Df 0.0021; Synamic 6GX: Dk 3.73, Df 0.0050; Synamic8G: Dk 3.66, Df 0.0032; Synamic8GN: Dk 3.28, Df 0.0019.

• High-speed circuits
• High-speed multilayer boards
• Server and data-center high-speed boards
• Automotive high-speed signal transmission circuits

A grade not previously included in the 'Low dielectric loss' sub-series of Shengyi's high-speed product category. Official brief description: S7439G is a low dielectric loss, halogen-free, high-heat-resistant laminate material for high-speed circuits.

Dielectric const.:3.74; Loss factor:0.0060; Board thickness:0.20 mm~3.2 mm; Copper foil thick.:18 µm~70 µm; Tg:170℃~210℃; Peel strength:≥1.1 N/mm; Frequency band:10 GHz~28 GHz

• High-speed circuits
• High-speed multilayer boards
• Halogen-free high-heat-resistant laminate applications