AutoLink

Auto-Link's flagship smart cockpit domain controller, built on the Qualcomm Snapdragon SA8155P platform. It uses Hypervisor virtualization to run a dual OS on a single chip (Android+QNX), supports up to 6 HD displays and 12 camera inputs, and provides rich expansion interfaces such as eDP/DSI/CSI/PCIe. It has been designated for 86 vehicle models and put into production for 71.

Model: AL-C1; Chip platform: Qualcomm Snapdragon SA8155P; Display outputs: up to 6 HD channels; Camera inputs: up to 12; Operating system: Android + QNX with Hypervisor virtualization; Interfaces: eDP/DSI/CSI/PCIe; Operating temperature: -40°C to +85°C

• Multi-screen interactive infotainment system
• Digital cluster and center display
• In-vehicle voice and navigation
• 360° surround-view imaging

A high-end smart cockpit domain controller based on the Qualcomm Snapdragon SA8255P, delivering 230K DMIPS CPU and 48 TOPS NPU. It supports 8 displays (up to 4K/8K) and 12 cameras, integrates APA/RPA parking algorithms and CMS, achieves ASIL-B functional safety, supports on-device large models, and is in production for models such as Jetour.

Model: AL-C2; Chip platform: Qualcomm Snapdragon SA8255P; CPU computing power: 230K DMIPS; NPU computing power: 48 TOPS; Display outputs: 8 channels up to 4K/8K; Camera inputs: 12; Functional safety: ASIL-B; Parking algorithms: APA/RPA and CMS

• 8-screen 4K/8K multi-display rendering
• AR-HUD visualization
• AI voice assistant
• Cockpit-parking integrated parking

A high-end cockpit-parking integrated domain controller based on the Qualcomm Snapdragon SA8775P, with 230K DMIPS CPU and 96 TOPS NPU. A single SoC fuses cockpit and parking, supporting urban NOA (some scenarios), memory driving and memory parking, covering center/cluster/HUD/AVM/DMS/OMS, and reaching ASIL-B (with built-in ASIL-D safety island).

Model: AL-C3; Chip platform: Qualcomm Snapdragon SA8775P; CPU computing power: 230K DMIPS; NPU computing power: 96 TOPS; Architecture: single SoC cockpit-parking integration; Functional safety: ASIL-B with built-in ASIL-D safety island; Camera inputs: 12; Display channels: centre/cluster/HUD/AVM

• High-end smart cockpit
• Urban NOA assisted driving
• Memory driving and memory parking
• DMS/OMS occupant monitoring

An entry-level smart cockpit system based on the Qualcomm QCM6490/QCM6125 platform, integrating T-Box and vehicle gateway. A single control unit supports dual displays and up to 8 cameras, targeting extreme cost-performance models such as A0/A-class, A+ and B-class, balancing cost with basic intelligent needs.

Model: AL-I1; Chip platform: Qualcomm QCM6490/QCM6125; Display outputs: 2 channels dual screen; Camera inputs: up to 8; Wireless connectivity: Wi-Fi/BT/4G/GPS; Integrated functions: T-Box and vehicle gateway; Target segments: A0/A, A+ and B class

• A0/A-class vehicle cockpit
• Dual-screen interaction
• In-vehicle connectivity
• Low-cost high value-for-money solution

A smart cockpit system based on the domestic automotive-grade SoC SemiDrive X9, supporting up to 4 screens (cluster/IVI/HUD) and 9 cameras (DVR/DMS/AVM). It integrates Wi-Fi/BT/4G/GPS, reuses the Qualcomm solution software stack, and improves supply-chain resilience and cross-platform software reuse.

Model: AL-N1; Chip platform: SemiDrive X9 automotive-grade SoC; Display outputs: up to 4 screens (cluster/IVI/HUD); Camera inputs: 9 (DVR/DMS/AVM); Wireless connectivity: Wi-Fi/BT/4G/GPS; Software stack: reusable from the Qualcomm platform; Operating temperature: -40°C to +85°C

• Domestic-chip smart cockpit
• DMS/AVM imaging
• Multi-screen display interaction
• Localized supply-chain solution

A mid-range smart cockpit domain controller based on the MediaTek MT8675, with about 120K DMIPS general compute. It integrates cluster/center/HUD in one unit, supports AVM/DMS/OMS and optional 4G/5G T-Box, and its platform-based modular architecture enables efficient adaptation across models and component reuse.

Model: AL-M1; Chip platform: MediaTek MT8675; General computing power: about 120K DMIPS; Display outputs: cluster/centre/HUD in one unit; Camera inputs: up to 8; Communication module: optional 4G/5G T-Box; Vision functions: AVM/DMS/OMS

• Front-row infotainment
• AVM/DMS/OMS
• Integrated cluster-center-HUD
• T-Box in-vehicle communication

A mid-to-high-end smart cockpit domain controller based on the MediaTek MT8676, with about 170K DMIPS general compute, 1.8 TFLOPS graphics and 20 TOPS AI. It supports 16 cameras and 6-screen output, 3D desktop/transparent chassis, and integrates 5G (Cat-19) with downlink up to 1.6 Gbps.

Model: AL-M2; Chip platform: MediaTek MT8676; General computing power: about 170K DMIPS; Graphics computing power: 1.8 TFLOPS; AI computing power: 20 TOPS; Camera inputs: 16; Display outputs: 6 screens; 5G downlink: Cat-19 up to 1.6 Gbps

• 3D interactive smart cockpit
• AR-HUD display
• Transparent chassis visualization
• Cloud large-model applications

A cockpit-driving fusion domain controller based on the Qualcomm Snapdragon Ride Flex SA8775P, where a single SoC fuses the cockpit and ADAS domains. It is the world's first mass-produced single-chip cockpit-driving fusion solution, supports 7B/13B on-device model deployment and multi-sensor coordination, and has been designated for 10 models with 4 in production.

Model: AL-A1; Chip platform: Qualcomm Snapdragon Ride Flex SA8775P; Fusion architecture: single SoC cockpit-driving integration; NPU computing power: 96 TOPS; On-device models: 7B/13B class; Camera inputs: up to 12; Functional safety: ASIL-D; High-speed interfaces: PCIe and Gigabit Ethernet

• Cockpit-driving fusion computing
• On-device large-model deployment
• Multi-sensor visual fusion
• High-speed data transfer and real-time decisions

A high-end central cockpit-driving fusion platform based on the 5th-generation Qualcomm Snapdragon 8797, with CPU 560K+ DMIPS, GPU 8.1 TFLOPS and NPU 640 TOPS (sparse). It supports 8 screens, 8K+ and 20 cameras, 13B on-device models, shares cross-domain compute via an optical PCIe ring network, and targets L3/L4.

Model: AL-A2; Chip platform: 5th-generation Qualcomm Snapdragon 8797; CPU and GPU computing power: 560K+ DMIPS and 8.1 TFLOPS; NPU computing power: 640 TOPS sparse; Camera inputs: 20; Display outputs: 8 screens at 8K+; On-device models: 13B; Cross-domain link: optical PCIe ring network

• L3/L4 autonomous driving
• Robotaxi platform
• On-device AI Agent
• Multi-domain collaborative computing

A self-developed automotive-grade operating system from Auto-Link that serves as the software foundation for in-vehicle computing. It connects the hardware layer with cockpit applications, supports voice/gesture/gaze/touch multimodal interaction, 3D visualization, DMS and OTA, and its layered modular architecture adapts to multiple hardware platforms and flexible OEM customization.

Software version: Autosee OS; Interaction modalities: voice, gesture, gaze and touch; Graphics capability: real-time 3D rendering; Driver monitoring: DMS supported; Update method: SOTA/OTA remote upgrade; Hardware adaptation: Qualcomm, MediaTek and SemiDrive platforms; Architecture: layered and modular

• Multimodal human-machine interaction
• 3D visualization interface
• Driver state monitoring
• SOTA/OTA continuous upgrade

High-resolution display components for Auto-Link's smart cockpit system, including the digital cluster, center infotainment screen and passenger screen. The cluster shows speed/battery/navigation, the center supports touch/voice/gesture, and the passenger can enjoy independent entertainment and control cockpit functions.

Components: digital cluster, centre screen and passenger screen; Resolution: up to 3840x2160 (4K); Screen size: 8 to 15.6 inches; Brightness: 500 to 1000 cd/m²; Touch method: multi-point capacitive touch; Display interface: eDP/LVDS; Operating temperature: -30°C to +85°C

• Digital cluster information display
• Center infotainment
• Independent passenger entertainment
• Touch/voice/gesture interaction

An automotive-grade zonal controller that acts as a control node in the E/E architecture, managing body electronics/lighting/power distribution/comfort functions. It uses automotive MCU with CAN-FD/LIN/Ethernet and E-Fuse+MOSFET power, runs software based on AUTOSAR Classic and ISO 26262, contains over 100 reusable modules (about 80% platformized) and the AL-Z2 zonal compute controller (ASIL-D).

Model: AL-Z2 zonal compute controller; Main controller: automotive-grade MCU; Bus interfaces: CAN-FD/LIN/Ethernet; Power stage: E-Fuse plus MOSFET; Software architecture: AUTOSAR Classic; Functional safety: ISO 26262 ASIL-D; Reusable modules: over 100, about 80 percent platformized; Operating temperature: -40°C to +105°C

• Body electronics control
• Lighting and power distribution management
• Seat/door control
• Cross-domain service routing

Auto-Link's on-device AI compute unit, based on the Qualcomm Snapdragon 9075, can connect independently to existing cockpit platforms, integrating large-model inference and multimodal perception into automotive-grade standalone hardware, providing a low-cost AI upgrade path for existing vehicle models without major retrofitting.

Model: AL-C3; Chip platform: SoC 7nm; Compute: 150 TOPS; Memory: 12 GB LPDDR5; Storage: 64 GB eMMC; Display outputs: 2× DP; Camera inputs: 8× CSI; Operating system: Linux+QNX; Operating temperature: -40℃~+85℃

• AI upgrade for existing models
• On-device large-model inference
• Multimodal perception
• External-cabin perception fusion