WUS Printed Circuit

WUS Printed Circuit's official product center lists high-layer-count backplane products, reaching up to 64 layers, used in core network equipment such as high-end routers, switches, and storage (cloud computing).

Up to 64 layers; max board thickness 0.374 inch (9.5mm); max panel size 24x48 inch (612x1219mm); supports backdrill, HDI, buried/embedded copper blocks and other processes.

• High-end routers
• Switches
• Storage (cloud computing)
• Core network (wired)

WUS Printed Circuit's official product center lists line card products - high-density daughterboards that plug into the backplane, host optical modules, and handle external network traffic transmit/receive, used in high-speed switches and routers.

Up to 40 layers; high-density design; max board thickness 0.180 inch (4.5mm); max panel size 24x42 inch (612x1070mm).

• High-speed switches
• Routers
• Optical module carrier board
• Core network (wired)

WUS Printed Circuit's official product center lists power amplifier products, primarily supporting filters and power amplifiers in base stations, belonging to the wireless telecommunication infrastructure product series.

2-64 layers; supports blind/buried vias, HDI, backplane, backdrill, heat sinks (copper block bonding, buried/embedded copper blocks, Pre-Bonding/Post-Bonding copper blocks), Teflon (PTFE), ceramic-filled, groove/step grooves, multi-material full/partial hybrid lamination, embedded capacitance.

• Base station power amplifier
• Filters
• Telecom infrastructure (wireless)
• 5G/4G/WiMax/LTE

High-frequency/mmWave radar antenna PCB: WUS has provided antenna PCB solutions since 2002, covering Sub-6G low bands and mmWave high bands, a core product for automotive mmWave radar and base-station antenna RF boards, also a known subset of the existing NEV product line.

Low band (Sub-6G) and High band (mmWave) solutions; up to 14 layers (including transceiver multilayer boards); uses Teflon (PTFE), ceramic-filled and other low-loss high-frequency materials; supports multi-material hybrid lamination; 77GHz radar boards are in mass production and applied in 4D automotive radar.

• Automotive mmWave radar (77GHz/24GHz/4D radar)
• Base station antenna
• Sub-6G RF array
• ADAS (radar/camera)

WUS Printed Circuit's official product center lists server products targeting high-end servers, AI servers/HPC computing, and industrial computers, a core growth engine for the company's data-communications and AI-computing business.

Up to 34 layers (industry also mass-produces 22-78 layer high-layer backplanes/mainboards); max board thickness 200 mils (5mm); max panel size 24x36 inch (612x916mm); supports thick copper, HDI, backdrill and other processes.

• AI servers
• HPC high-performance computing
• General servers
• Industrial computers

WUS Printed Circuit's official product center lists hybrid products using full/partial multi-material hybrid lamination combined with high-frequency/high-speed materials, meeting the strict impedance and loss requirements of base stations, antennas, and automotive RF.

Supports hybrid lamination of multiple materials such as Teflon (PTFE), ceramic-filled, and high-frequency/high-speed resins (e.g., M6/M7/M8/M9 systems); full/partial hybrid lamination, embedded capacitance, groove/step grooves and other processes.

• Base station RF
• Antenna
• mmWave radar
• High-speed switch/backplane

Automotive PCB: WUS's official customer-category automotive line covers braking/steering/powertrain, new-energy motors, battery management, inverters, ADAS (radar/camera), body electronics, and in-vehicle entertainment & navigation - a known subset of the existing NEV product line.

Double-sided to 12-layer through-hole boards, mechanical blind vias, HDI, HF/RF hybrid boards, semi-flex boards, 3-6oz thick copper, ceramic-embedded boards, copper-block-embedded boards; advanced ADAS domain controller HDI up to 16 layers; supports 800V high-voltage platform and P2Pack embedded power-chip technology.

• NEV three-electric system
• ADAS domain controller
• mmWave radar
• Smart cockpit
• Body electronics & in-vehicle entertainment

Power equipment PCB, listed in the official customer category, targets DC-DC converters and high-end equipment/computer power supplies, using thick-copper processes to carry large currents.

Thick copper 3oz-12oz; up to 20 layers.

• DC-DC converter
• High-end equipment power supply
• Computer power supply

Computer/PC PCB, listed in the official customer category, targets high-end servers and industrial computers, mainly high-layer-count through-hole boards.

Through-hole boards up to 40 layers; dimensions up to 24x42 inch.

• High-end servers
• Industrial computers
• Data centers

Telecom infrastructure (wireless) PCB, listed in the official customer category, targets base stations (4G/5G/WiMax/LTE), antennas, filters, and power amplifiers, using various high-frequency/high-speed materials and processes.

2-64 layers; blind/buried vias, HDI, backplane, line card/daughter card, backdrill, heat sinks (copper block bonding/embedded copper blocks), Teflon, ceramic-filled, groove/step grooves, multi-material hybrid lamination, embedded capacitance.

• 5G/4G base station
• Antenna
• Filter
• Power amplifier

Core network (wired) PCB, listed in the official customer category, targets high-end routers, switches, and storage (cloud computing), mainly high-technology through-hole boards and backplanes up to 64 layers.

Up to 64-layer backplane; HDI; up to 64-layer high-technology through-hole board; backdrill process.

• High-end routers
• Switches
• Storage (cloud computing)
• Data centers

Semiconductor PCB, listed in the official customer category, targets chip-design custom products, emulators, ATE testing, burn-in testing, wafer test carriers, and probe-card carriers in semiconductor testing and packaging scenarios.

Model: WUS-012; Dielectric constant: 3.0±0.04; Loss tangent: 0.002; Board thickness: 0.8 mm; Copper thickness: 18 μm; Layers: 4 L; Tg: Tg 170℃; Frequency band: 77 GHz; Dimensional tolerance: ±0.08 mm

• Chip testing (ATE)
• Wafer test carrier
• Probe card carrier
• Semiconductor packaging

Industrial PCB, listed in the official customer category, targets power control, temperature/humidity control, factory automation, construction machinery, and office equipment, covering high-reliability scenarios such as industrial control and medical.

Double-sided to 16-layer through-hole boards, mechanical blind vias, HDI, semi-flex boards, 3-6oz thick copper, etc.; can withstand extreme environments from -40C to 125C and is certified by UL and others.

• Industrial automation
• Medical equipment
• Power control
• Construction machinery

HDI (High-Density Interconnect), as WUS's advanced manufacturing technology spanning multiple business lines, is applied in automotive domain controllers, mobile/consumer substrates, servers, and industrial control, and is the core process platform for the company's high-frequency/high-speed and automotive-grade advanced boards.

Supports mechanical blind vias, any-layer interconnect (Any-layer), POFV (VIPPO), 10+ stage HDI, mSAP semi-additive process; line width/spacing down to 10um/10um level; automotive-grade HDI up to 16+ layers.

• ADAS domain controller
• Smart cockpit
• AI server/high-end mainboard
• Consumer electronics & industrial control