Company profile
United Nova Technology Co., Ltd. is a verified Chinese manufacturer in the new-energy vehicle supply chain. Its documented manufacturing scope includes Automotive power-chip, MEMS and analogue-IC foundry services.
Products
MEMS Process Platform
The MEMS process platform of United Nova Technology features a complete technology layout and advanced capabilities, including CMOS-MEMS single-chip integration and wafer-level packaging. Its technology routes cover open-cavity structures (MEMS microphones, pressure sensors, ultrasonic sensors) and closed-cavity structures (oscillators, accelerometers, gyroscopes) among other MEMS device categories, and it provides customers with customized process development and large-scale mass production solutions.
Technology routes: open-cavity and closed-cavity types; CMOS-MEMS single-chip integration capability; wafer-level packaging (WLP) capability; more than ten years of deep expertise in MEMS with extensive R&D and high-volume production experience; customized process development and large-scale mass production available
- Consumer electronics
- Automotive electronics
- Industrial control
- Internet of Things
- Healthcare
- Smartphones and wearable devices
MOSFET Process Platform
United Nova Technology offers a complete MOSFET process platform covering trench MOSFETs, split-gate MOSFETs and super-junction MOSFETs, with advanced backside processes and special metal deposition processes, providing customers with customized process development and large-scale mass production solutions; the portfolio also includes automotive-grade silicon carbide (SiC) MOSFET chips and modules.
Process types: trench MOSFET, split-gate MOSFET, super-junction MOSFET; includes advanced backside processes and special metal deposition processes; covers automotive-grade SiC MOSFET chips and modules; customized process development and large-scale mass production available
- Consumer electronics
- Industrial control
- Electric vehicles
- New energy vehicles
- Photovoltaics and energy storage
IGBT Process Platform
United Nova Technology builds on a field-stop IGBT structure and adopts industry-leading backside processing technologies such as backside thinning, ion implantation, laser annealing and special metal deposition; devices in the 600 V to 1200 V range are already in large-scale mass production, and the company also provides fast recovery diode (FRD) foundry services while covering automotive-grade IGBT chips and power modules.
Structure: field-stop IGBT; voltage classes: 600 V to 1200 V; backside processes: thinning, ion implantation, laser annealing, special metal deposition; flexible metal layer selection; supporting fast recovery diode (FRD) foundry; already in large-scale mass production
- Industrial variable-frequency drives
- White goods
- Rail transit
- Electric vehicles
- Smart grid
- Wind power
- Solar energy
- New energy vehicles
BCD Process Platform
The automotive-grade BCD process platform of United Nova Technology delivers complete high-voltage, high-current and high-density analog and power solutions for automotive, new energy, high-end industrial control and Internet of Things applications; it integrates distinctive platforms such as BCD+eflash (SST), IPS (BCD+MOS) and BCD-SOI, and offers automotive-grade AEC-Q100 G0/G1/G2 high-reliability processes.
Voltage range: 5 V-150 V and 250 V-650 V; process node: 0.35 um; distinctive platforms: BCD+eflash (SST), IPS (BCD+MOS), BCD-SOI; isolation schemes: PN junction isolation, deep trench isolation, SOI isolation; automotive-grade AEC-Q100 G0/G1/G2 reliability processes; 12-inch fabs supporting aluminum and copper back-end-of-line processes; complete digital core and embedded non-volatile memory IP
- Automotive
- Industrial control
- Server and computing centers
- Smart grid
- Wind power
- Solar energy
- New energy
- Internet of Things
- High-end industrial control
One-Stop Back-End Service (Power Module Packaging and Testing)
United Nova Technology provides one-stop back-end services spanning wafer manufacturing through power module packaging and testing, including high-power IGBT modules, MOSFET IPM modules and other system-level integrated packages, with full data traceability and tracking from modules back to wafers and chips.
Scope of service: one-stop from wafer manufacturing to power module packaging and testing; products include high-power IGBT modules, MOSFET IPM modules and system-level integrated packages; full data traceability and tracking from module to wafer/chip; customized process development and large-scale mass production
- Consumer electronics
- Industrial variable-frequency drives
- White goods
- Rail transit
- Electric vehicles
- Smart grid
- Wind power
- Solar energy
- New energy vehicles
Automotive-Grade MCU (Microcontroller)
United Nova Technology lists the MCU (microcontroller) as one of its core product series, alongside MEMS, power devices and analog ICs, delivering one-stop system foundry solutions covering R&D, production and sales for AI, automotive, new energy, industrial control and home appliance applications, as stated on the company introduction page of the official website.
Product type: MCU (microcontroller); core product series alongside MEMS, power and analog ICs; aimed at automotive-grade and high-end industrial control applications; one-stop system foundry solutions provided
- Automotive
- New energy
- Industrial control
- Home appliances
- AI
Production evidence
Official or authoritative public sources confirm manufacturing capability for Automotive power-chip, MEMS and analogue-IC foundry services and a direct connection to new-energy vehicles.
This profile is based on confirmed public information. It is not an audit, certification or commercial endorsement.
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