Electric Connector Technology Co., Ltd.

ECT automotive connectors (vehicle RF connectors) cover the Fakra and HSD series and are compatible with many mainstream overseas brands and a wide range of application requirements. The harnesses accept several wire gauges and meet international industry standards. The range is complete and cost-effective, and volume production introduction has already begun at a number of major domestic automakers. Connectors for LVDS, USB, antenna and 360-degree HD applications in in-vehicle infotainment are fully covered, and complete selection and replacement solutions are available.

Fakra: characteristic impedance 50 ohm; frequency range DC to 6 GHz; return loss >=26 dB (DC-1 GHz) / >=24 dB (DC-3 GHz); insertion loss <=0.1 x sqrt f(GHz) dB at 1 GHz; insulation resistance >=100 Mohm; contact resistance 40 mohm max; outer contact resistance 40 mohm max; test voltage 800 V rms; operating voltage <=60 V DC; contact current <=1 A DC; shielding attenuation >=65 dB. The HSD series is an automotive high-speed RF connector line with a broad portfolio.

• In-vehicle infotainment (LVDS/USB/antenna/360 HD)
• Automotive antenna RF connection
• Volume production introduction at major automakers

ECT automotive and data-centre high-speed connectors cover board-to-board (BTB) solutions and high-speed cable assemblies. The cable range is complete and can be customised, automation is extensive, capacity is ample and delivery is stable. A single interface is compatible with several association standards, serving automotive high-speed links, AI computing servers and enterprise storage arrays.

HD MINISAS: compliant with SFF-8643/8644/8086 and SAS 3.0, 12 Gbps per lane and 48 Gbps over four lanes, 100 ohm differential impedance, operating range -40 to +85 degC; OCULINK: SFF-8611/8612, PCIe 4.0 at 16 GT/s per lane and 64 Gbps over four lanes, 85 ohm differential impedance, 0.5 mm pitch; SlimSAS: SAS 4.0 at 24 Gbps per lane; BTB pitch 0.4 mm H0.8: rated voltage 60 V, rated current 0.3 A per pin, withstand voltage 150 V DC; BTB pitch 0.35 mm H0.60: rated voltage 20 V, signal contact 30 mohm max per pin, ground 5 mohm max per pin.

• Automotive high-speed links
• AI computing servers/data centres
• Enterprise storage arrays (RAID/NVMe)
• Automotive electronics

ECT antennas span PCB, FPC, metal and ceramic types and cover in-house R&D, production and assembly. The company operates a Satimo anechoic chamber and test equipment able to satisfy customer testing and customisation requirements, and can also supply complete RF solutions including antennas, USS cables, USS sockets, RF switches and test cables.

Frequency coverage 433 MHz to 5 GHz (including 433-435/2400-2500/700-960/1710-2700/617-5000 MHz bands); characteristic impedance 50 ohm; gain -7.65 to 7.13 dBi; VSWR <=2.0 to 4.0; structures include spring, whip, magnetic-mount, FPC+cable and omni antennas; operating temperature -40 to +85 degC.

• Automotive antennas
• Internet of Things (IoT)
• Wireless communication/GPS/WiFi/Bluetooth
• External antennas for smart terminals

The MINI RF miniature RF switch connector series covers the specification of every mainstream manufacturer in the industry. It is produced with fully automated, large-scale manufacturing and is supported by core proprietary intellectual property. It is ECT's flagship product and earned the company the title of National Manufacturing Single-Item Champion Enterprise (8th edition).

Frequency range DC to 11 GHz (some DC to 6 GHz); characteristic impedance 50 +/-5 ohm; rated voltage 60-250 V AC (r.m.s.); operating temperature -40 to +85 degC; insulation resistance 500 Mohm (or 100 Mohm); withstanding voltage 100-300 V AC; VSWR 1.40-1.70 max; insertion loss 0.3-0.85 dB max; isolation 10-15 dB max; durability 30-15000 cycles.

• Smartphones/consumer electronics
• Internet of Things (4G/NB-IoT/LoRa)
• 5G RF front end
• RF interconnect modules

The USS RF miniature RF connector series offers prompt technical support and short lead times for volume production together with flexible supply. It is built on long-term strategic cooperation with terminal brand customers, and product and technology development is continuous, allowing complete connection solutions to be provided.

Frequency range DC to 6 GHz / DC to 8 GHz; characteristic impedance 50 ohm; operating temperature -40 to +85 degC; insulation resistance 100 Mohm; withstanding voltage 300/500 V AC; VSWR 1.20-1.60 max; insertion loss 0.35-3.00 dB max; rated voltage 60 V AC (r.m.s.); inner/outer conductor resistance 100 mohm; durability 1000-25000 cycles.

• Smartphones and other consumer electronics
• RF interconnection
• IoT terminals

The SCS RF miniature RF connector series offers prompt technical support and short volume-production lead times at a competitive price-performance ratio. It supports long-term strategic cooperation with terminal brand customers, and product and technology development is continuous.

Frequency range DC to 3 GHz / DC to 6 GHz; characteristic impedance 50 ohm; operating temperature -30 to +85 degC (or -40 to +80 degC); insulation resistance 100-1000 Mohm; withstanding voltage 100/500 V AC; VSWR 1.30-1.60 max; insertion loss 1.00-2.45 dB max; rated voltage 250 V AC (r.m.s.); inner/outer conductor resistance 100 mohm.

• Consumer electronics RF connection
• IoT terminals
• Wireless communication modules

Standard SMA and MCX interface RF connectors come in a wide range of horizontal and vertical versions so that customers can select for different structural projects. They are fully covered by proprietary intellectual property and can be customised to specific requirements. High-frequency versions reach 6 GHz (some 18 GHz) and are widely used in routers, small cells and smart electricity meters.

SMA RF switch: frequency DC to 3 GHz / DC to 6 GHz, 50 ohm, VSWR 1.5-1.6 max, insertion loss -0.5 to -0.8 dB max, isolation -10 to -15 dB min, rated voltage 100-335 V AC; SMA PCB jack: frequency DC to 6 GHz / DC to 10 GHz / DC to 18 GHz, 50 +/-5 ohm, VSWR <=1.30-1.50, insertion loss <=0.1 x sqrt f(GHz) dB, mechanical life >=500 cycles, compliant with MIL-STD-348.

• Routers/small cells
• Smart electricity meters
• RF connection in communication equipment
• 5G base stations

The FPC CONN series is diverse and complete in specification, with a wide pin-count range that supports customer-specific pin requirements. The process is mature with fully automated production, a high degree of automation, ample capacity and stable delivery. Every series offers good locking performance that ensures stable contact.

Pitch 0.3 mm H1.0 front flip: working voltage AC 30 V, maximum load current 0.2 A, insulation resistance 50 Mohm min, withstanding voltage 150 V AC/60 s, contact resistance 50/100 mohm max, retention force 0.13 N per pin min, operating temperature -55 to +85 degC; pitch 0.5 mm H1.0 front flip: working voltage AC 50 V, current 0.5 A, insulation resistance 500 Mohm min, retention force 0.2 N per pin min; pin counts from 4 to 45.

• Smartphones/consumer electronics
• Liquid-crystal modules
• Industrial control
• Automotive electronics

RF board-to-board (BTB) connectors draw on volume production experience at KK-level scale and on professional RF performance test capability. The board-to-board product uses a reinforced metal guide structure with ground-plate protection and is covered by proprietary intellectual property.

BTB pitch 0.4 mm H0.8: 10/24/30/40P, rated voltage 60 V AC/DC, rated current 0.3 A per pin max, insulation resistance 1000/100 Mohm, withstanding voltage 150 V DC/60 s, contact resistance 50/90 mohm max, operating temperature -40 to +85 degC; BTB pitch 0.35 mm H0.60: 16+2P/24+2P, rated voltage 20 V, withstanding voltage 200 V AC/60 s, signal contact 30 mohm max per pin, ground 5 mohm max per pin.

• Smartphone mainboard interconnection
• RF modules
• Consumer electronics
• High-speed interconnection

Wire-to-board (BTCC) connectors provide signal connections between printed circuit boards. Multi-functional terminals can be mounted in a single package, so design changes can be accommodated easily with a new size, and board-level interconnection delivers greater performance in the most demanding applications.

BTCC connector: pitch 0.30 mm, H 1.45 mm, covering 26/30/40/50 pin; three structural parts comprising REC conn. (receptacle), male shell and male body; used for signal connection between PCBs.

• Signal connection between PCBs
• Consumer electronics
• Industrial equipment
• Automotive electronics

The HD MINISAS high-speed connector series follows the SFF-8643/8644/8086 industry specifications and is widely used for internal interconnection in AI computing servers, HPC systems, enterprise high-speed storage arrays, RAID disk modules and industrial accelerator cards. It is a preferred solution for next-generation high-density data-centre storage and compute interconnection.

Four-lane high-speed transmission architecture with terminals integrating high-speed signal, power, ground and auxiliary signal circuits; native SAS 3.0 support at 12 Gbps per lane and 48 Gbps over four lanes; 100 ohm standard differential impedance with precision shielding; the same connector supports direct board-to-board and cable-assembly interconnection; keyed locking structure; operating range -40 to +85 degC.

• AI computing servers
• HPC high-performance computing
• Enterprise storage arrays
• RAID disk modules

The MINISAS, OCULINK and SlimSAS ultra-high-speed connector series address general-purpose storage interconnection, PCIe high-speed interconnection and lightweight high-density storage interconnection respectively. They serve AI edge computing, NVMe SSDs, external graphics-card expansion and high-speed industrial equipment interconnection.

MINISAS: compliant with the general MINISAS specification and supporting high-speed SAS transmission; OCULINK: SFF-8611/8612, PCIe 4.0 at 16 GT/s per lane and 64 Gbps over four lanes, 85 ohm differential impedance, 0.5 mm ultra-fine pitch; SlimSAS: SAS 4.0 at 24 Gbps per lane with multi-lane combinations for very high bandwidth; all fitted with keyed locking structures and rated for -40 to +85 degC.

• NVMe high-speed solid-state storage
• External GPU expansion
• AI edge computing devices
• High-density industrial equipment

USB Type-C is the new standard plug or receptacle providing a multi-functional single-cable solution for USB, power and audio/video. It is compact and extremely reliable, perfectly suited to laptops and tablets, and is the connection technology for all future devices.

Includes USB 2.0 Type-C plug/receptacle and USB 3.1 Gen I Type-C plug/receptacle; rated current 5 A; withstanding voltage 100 V AC (RMS); insulation resistance 100 Mohm min at DC 100 V; contact resistance 50 mohm max; insertion force 5-20 N; extraction force 8-20 N; mating durability 10000 cycles min.

• Mobile phones/smartphones
• Laptops/tablets
• Consumer electronics charging and data transfer
• Automotive electronics

A comprehensive precision metal spring contact library gives customers a ready-made and wide choice, while professional and prompt technical support is available for new product design. Strong production capacity and a quality assurance system ensure stable delivery.

Rated current 2 A; rated voltage 10 V DC; rated power 20 W; contact resistance 50 mohm max; mechanical life 1500 cycles; working range 0.45-2.2 mm (multiple specifications); operating temperature -45 to +85 degC; storage temperature -30 to +70 degC.

• Smartphone antenna spring contacts
• Consumer electronics grounding/shielding
• Battery connection
• Industrial equipment

ECT has its own LCP R&D team combining routing design, simulation and RF functional testing, and works with ECT RF BTB products to deliver complete solutions. The FPC manufacturing team has more than 20 years of experience and has introduced extensive advanced equipment to supply high-density, high-layer-count and high-performance products, with continuous capacity expansion.

Layer count 1-8 (HDI); minimum line width/spacing 0.05/0.05 mm; minimum hole diameter/annular ring 0.08/0.08 mm; surface finish gold plating/ENIG/immersion gold; impedance 50 +/-5 ohm / 90 +/-9 ohm / 100 +/-10 ohm; LCP-FPC used for mobile communication RF; capable of handling rush orders and high-volume production.

• Smartphone communication
• Smart wearables
• Wireless charging
• LCP RF modules
• Automotive electronics (with RF BTB)